New rules have been added at the PCB layout stage to improve overall system productivity. A range of constraints can now be checked in real-time during the design process and before the fabrication of files, helping you avoid unnecessary design respins and getting to market faster.

Improved Rules

Checking on the following rules has been significantly enhanced.
Improved Rule - Minimum Copper Width
Improved Rule - Acute Angle

New Rules

The following new rules have been added to the system to catch various manufacturing issues.
New Rule - Hole to Hole Clearance
New Rule - Minimum Solder Mask Sliver
New Rule - Net Antennae
New Rule - Silk Over Component Pads
New Rule - Silk to Silk Clearance