IPC-Compliant Batch Footprint Generator Reference

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This reference provides technical information on configuring and using the IPC® Compliant Footprints Batch Generator to generate IPC compliant footprints in a PCB library document.

Building IPC compliant footprints from datasheet package information files quickly and easily is made possible by the use of the IPC Compliant Footprints Batch Generator.
The generator reads the datasheet package information (dimensional data of electronic components) from Excel spreadsheets or comma delimited files and then applies the IPC equations to build IPC compliant footprints.
Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data. The spreadsheet is then fed into the generator to build IPC compliant footprints in PCB libraries.
The following sections of this reference detail the dimensional data of each component package type for the Altium Designer's IPC Compliant Footprints Batch Generator.

BGA

BQFP

Chip

CFP

CQFP

DPAK

LCC

MELF Diode/Resistor

Molded Capacitor/Diode/Inductor

PLCC

PQFP

QFN

QFN-2ROW

SOIC

SOJ

SOP

SOT23

SOT89

SOT143/343

SOT223

WireWound

 

 

 

 

Function

Figure 1. The IPC® Compliant Footprints Batch generator dialog.

The IPC Compliant Footprints Batch generator allows you to generate footprint package kinds in PCB library files (*.PCBLIB) from input files, which can be Excel workbooks or comma delimited files. Such files must contain formatted component dimensional data. You can use the blank template files from the Template folder as the starting point. You then generate batches of footprints according to their footprint name (package kind) in the table.

Content and Use

Make a copy of the required blank template files and fill in the fields for each package that need to have corresponding footprints generated. Details of the dimensional information are mandatory and which is optional, as well as references to the dimensions they represent on the package are outlined in the respective footprint sections below.

Then you can select the Tools»IPC Compliant Footprints Batch generator menu item in the PCB Library editor to launch the generator. Once the generator dialog is displayed, you can then add input package type files by clicking the Add Files button to select package input files, or drag and drop the files directly onto the dialog. Set the output folder to a suitable location.

You also have the option of generating all footprints in a footprint library, a single PCB library document per input file, or an individual PCB library per footprint name. The Generate single PcbLib files per input file option will generate a PcbLib in the output folder with the same name as the input file being processed, and the footprints from this file will be put into the Pcblib. The Generate single PcbLib files per footprint name option will generate a PcbLib in the output folder for every package in the input files; either from the FootprintName package field, or using the generated IPC naming convention name if the field is blank.

Click the Start button to process the input files and then the PcbLib files and footprints generated. To stop and close the batch process, click the Stop button or the Close button.

If the Generate report on completion option is selected, then a report in HTML format will be generated and displayed containing the processed files, and any errors or warnings generated.

IPC Compliant Footprint Batch Generator Component Types

BGA

BQFP

Chip

CFP

CQFP

DPAK

LCC

MELF Diode/Resistor

Molded Capacitor/Diode/Inductor

PLCC

PQFP

QFN

QFN-2ROW

SOIC

SOJ

SOP

SOT23

SOT89

SOT143/343

SOT223

WireWound

 

 

 

 

Package Dimensional Data and Type Summary

Component package data is illustrated by its physical image, its dimensional image and a table outlining the package's dimensional data such as its name, its format type and its function in tables as described in each package below.
Component package data are in metric (mm) measurement units only and is stored in an Excel file or a CSV text file and such files should contain data related to the specific package type only. Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data.
The first two lines in a package data template file correspond to the specific component package kind. For example, the BQFP (Bumpered Quad Flat Pack).xls file represents the BQFP package type. See an example of the BQFP data below.

BQFP

 

 

 

 

 

 

 

 

 

 

FootprintName

FootprintDescription

D1min

D1max

Dmin

Dmax

Lmin

Lmax

Pitch

Amax

A1min

BQFPS-44M

 

10.23

10.23

13.35

13.58

0.51

0.76

0.635

2.54

0.01

BQFPS-44M

 

11.5

11.5

14.61

14.85

0.51

0.76

0.635

2.54

0.01

BQFPS-68M

 

14.04

14.04

17.15

17.39

0.51

0.76

0.635

2.54

0.01

BQFPS-84M

 

16.58

16.58

19.69

19.93

0.51

0.76

0.635

2.54

0.01

Heel, Side and Toe Fillets Information

Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.
Note, that the fillet fields are optional for defining a package's dimensional data. If all the fillet fields are defined, then the generator will try and use these fields. However if there are one or more fields, but not all fillet fields are missing, or any of the fillet fields have invalid values in them, then the automatically calculated solder fillet values will be used instead.
The following packages have such fillets;
BQFP, Chip, CFP, CQFP, DPAK, LCC, MELF, Molded Capacitor/Diode/Inductor, PLCC, PQFP, QFN, QFN-2ROW, SOIC, SOJ, SOP, SOT23, SOT89, SOT143/343, SOT223 and Wirewound packages.

Land Pattern Information

Density Level A: Maximum (Most) Land Protrusion - For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull-wing devices. The geometry representing these devices, and inward and ''J''-formed lead contact device families, may provide a wider process window for reflow solder processes.
Density Level B: Median (Nominal) Land Protrusion - Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.
Density Level C: Minimum (Least) Land Protrusion - High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly.
For example, for those packages that have density level fields in package sections below, a typical table entry would look like this;

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

BGA - Ball Grid Array

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Dmin, Dmax

Yes

Real

Minimum and maximum Body Length ranges in mm.

D1ave

Yes

Real

Nominal Row Grid length of the package in mm.

Emin, Emax

Yes

Real

Minimum and maximum Body Width Ranges in mm.

E1ave

Yes

Real

Nominal column grid width of the package in mm.

A1min

Yes

Real

Minimum Standoff Height.

Amax

Yes

Real

Maximum Height.

Bnom

Yes

Real

Nominal ball diameter.

Pitch

Yes

Real

The pitch between any two pins in mm.

GridType

Yes

P, S

P = Plain Grid or S = Staggered Grid

MatrixType

Yes

F, P, SD, TE

F = Full Matrix, P = Perimeter, SD =.Selectively Depopulated, TE = Thermally Enhanced.

Rows

Yes

Integer

Number of rows for the grid.

Columns

Yes

Integer

Number of columns for the grid.

Nm

Yes

Integer

Maximum number of balls for this BGA package.

Np

Yes

Integer

The Np field is the actual number of balls available for this BGA package especially when the BGA is depopulated. It is not uncommon to have BGA packages with ball gaps. Np is always equal or less than Nm.

BQFP - Bumpered Quad Flat Pack

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

D1min, D1max

Yes

Real

Minimum and maximum body length ranges in mm.

Dmin, Dmax

Yes

Real

Minimum and maximum lead span ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum lead length range in mm.

Pitch

Yes

Real

Distance between any two leads in mm.

Amax

Yes

Real

Maximum height in mm.

A1min

Yes

Real

Minimum standoff height in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum Lead Width range in mm.

Nref

Yes

Integer

Number of leads for this package.

Pin1

Yes

S,C

S = Corner of Left Side or C = Center of Top Side.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

CFP - Ceramic Dual Flat Pack - Trimmed and Formed Gullwing Leads

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Dmax

Yes

Real

Minimum and maximum body length in mm.

E1max

Yes

Real

Minimum and maximum body width in mm.

A

Yes

Real

Maximum height in mm.

A1

Yes

Real

Minimum stand off height in mm.

BMin, BMax

Yes

Real

Minimum and maximum lead width ranges in mm.

Pitch

Yes

Real

The distance between the centres of two pins of the package in mm.

Dfmin, Dfmax

Yes

Real

Minimum and maximum lead span ranges in mm.

Lfmin, Lfmax

Yes

Real

Minimum and maximum lead length ranges in mm.

PinCount

Yes

Integer

Number of pins for this package.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JTmin

Optional

Real

Minimum value for the heel fillet.

JHmin

Optional

Real

Minimum value for the side fillet.

JSmin

Optional

Real

Minimum value for the toe fillet.

Chip - Capacitor / Inductor / Resistor

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Lmin, Lmax

Yes

Real

Minimum and maximum Body Length Ranges in mm.

Wmin, Wmax

Yes

Real

Minimum and maximum Width Length Ranges in mm.

Tmin, Tmax

Yes

Real

Minimum and maximum Bandwidth Ranges in mm.

Amax

Yes

Real

Maximum height in mm.

PackageType

Yes

C,I,R

C = Chip Capacitor, I = Chip Inductor or R = Chip Resistor.

PositivePin

Yes

Blank, 1, 2

If the chip is an Inductor or Capacitor or then need to specify Positive Pin and these types have only two pins. Blank = None, 1 = Pin 1 or 1 = Pin 2.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JTmin

Optional

Real

Minimum value for the heel fillet.

JHmin

Optional

Real

Minimum value for the side fillet.

JSmin

Optional

Real

Minimum value for the toe fillet.

CQFP - Ceramic Quad Flat Pack with Trimmed and Formed Gullwing Leads

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

D1min, D1max

Yes

Real

Minimum and maximum body ranges in mm.

Pitch

Yes

Real

Distance between any two leads of this package.

Amax

Yes

Real

Maximum height of package in mm.

A1min

Yes

Real

Minimum standoff height in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum lead width ranges in mm.

PinCount

Yes

Integer

Number of leads for this component package.

Pin1

Yes

C, S

C = Centre of top side or S = Corner of Left Side of the package.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

DPAK - Transistor Outline

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Hmin, HMax

Yes

Real

Minimum and maximum Length ranges in mm.

B1min, B1max

Yes

Real

Minimum and maximum lead width range in mm.

Dmax

Yes

Real

Maximum body length in mm.

L2min, L2max

Yes

Real

Minimum and maximum tab length ranges in mm.

Emax

Yes

Real

Maximum body width in mm.

L1min, L1max

Yes

Real

Minimum and maximum lead length ranges in mm.

L3min

Yes

Real

Minimum tab overhang in mm.

B2min, B2max

Yes

Real

Minimum and maximum tab width ranges in mm.

Amax

Yes

Real

Maximum height of package in mm.

A1min

Yes

Real

Minimum Standoff height in mm.

PinCount

Yes

Integer

The number of pins for this package.

TabNumber

Yes

String

The name for the tab.

TrimmedPins

Yes

String

Comma text string with pin names that are to be trimmed. Eg 1,2,3.

Pitch

Yes

Real

The distance between a pin and the short pin of the DPAK package.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JH1min, J2min

Optional

Real

Minimum values for the first and second heel fillets.

JS1min, JS2min

Optional

Real

Minimum values for the first and second side fillets.

JTmin

Optional

Real

Minimum value for the toe fillet.

LCC - Leadless Chip Carrier

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Emin, Emax

Yes

Real

Minimum and maximum body width ranges in mm.

Dmin, Dmax

Yes

Real

Minimum and maximum body length ranges in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum pin width ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum pin length ranges in mm.

L1min, L1max

Yes

Real

Minimum and maximum length ranges of pin 1 in mm.

Amax

Yes

Real

Maximum height of the package in mm.

A2max

Yes

Real

Maximum package height in mm (less than Amax).

NEref

Yes

Integer

Number of pins on side of E.

NDref

Yes

Integer

Number of pins on side of D.

Pitch

Yes

Real

Distance between any two pins in mm.

Pin1

Yes

S2, C1

S2 = Side of D or C1 = Center of E.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

MELF Component - Diode / Resistor

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Lmin, Lmax

Yes

Real

Minimum and maximum body length ranges in mm.

Wmin, Wmax

Yes

Real

Minimum and maximum body width ranges in mm.

Tmin, Tmax

Yes

Real

Minimum and maximum bandwidth ranges of pin 1 in mm.

Cathode

Yes

1,2

Required for MELF diodes only. Specify pin 1 or 2 for cathode.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

Molded Component - Inductor / Capacitor / Diode

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Lmin, Lmax

Yes

Real

Minimum and maximum body length ranges in mm.

Wmin, Wmax

Yes

Real

Minimum and maximum body width ranges in mm.

Tmin, Tmax

Yes

Real

Minimum and maximum lead length ranges in mm.

TwMin,TwMax

Yes

Real

Minimum and maximum lead width ranges in mm.

Amax

Yes

Real

Maximum height of the package in mm.

Cathode

Yes

1,2

Required for Molded diodes only. Specify pin 1 or 2 for cathode.

PositivePin

Yes

0,1,2

Required for molded inductor/capacitors only. Specify 0 for none, pin 1 or pin 2.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

PLCC - Plastic Leaded Chip Carrier Square with J Leads

Name

Required

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum stand off height of the package in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum lead width ranges in mm.

Dmin, Dmax

Yes

Real

The minimum and maximum lead span ranges in mm.

D1min. D1max

Yes

Real

The minimum and maximum lead span ranges in mm.

Pitch

Yes

Real

The distance between two leads of the package in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length ranges in mm.

Nref

Yes

Integer

The number of pins for this package.

Pin1

Yes

S,C

S = Corner of left side, C = Center of Top Side.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

PQFP - Plastic Quad Flat Pack

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Dmin, Dmax

Yes

Real

Minimum and maximum lead span ranges in mm.

Emin, Emax

Yes

Real

Minimum and maximum lead span ranges in mm.

Emax

Yes

Real

Maximum lead span range in mm.

D1min, D1max

Yes

Real

Minimum and maximum lead length ranges in mm.

E1min, E1max

Yes

Real

Minimum and maximum lead width ranges in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum lead length ranges in mm.

Pitch

Yes

Real

Distance between any two leads in mm.

Amax

Yes

Real

Maximum Height of the package in mm.

A1min

Yes

Real

Minimum Standoff Height in mm.

NDref, NEref

Yes

Integer

NDref = number of pins for D side and NEref = no of pins for E side.

Pin1

Yes

S2, C1

S2 = Side of D or C1 = Center of E.

ThermalPadExists

Yes

True, False

If this field contains a True then D2/E2 fields are required to define thermal pad, but if blank/False then D2/E2 fields are not required.

D2min, D2max
E2min, E2max

Optional

Real

Specify the minimum and maximum thermal pad ranges on D2 and E2 sides in mm only if the ThermalPadExists field is True.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment .

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

QFN - Quad Flat Pack No Lead Type

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Dmin, Dmax

Yes

Real

Minimum and maximum body span ranges in mm.

Emin, Emax

Yes

Real

Minimum and maximum body span ranges in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length ranges in mm.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum standoff height in mm.

A3min, A3max

Yes

Real

The minimum and maximum lead heights in mm.

NDref

Yes

Integer

Number of pins on E side of the package.

NEref

Yes

Integer

Number of pins on D side of the package.

Pitch

Yes

Real

The distance between two pins of the package in mm.

Pin1

Yes

S2, C1

S2= Side of D or C1= Center of E.

ThermalPadExists

Yes

True, False

If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/False then D2/E2 fields are not required.

D2min, D2max

Optional

Real

Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True.

E2min, E2Max

Optional

Real

Specify the minimum and maximum thermal pad range on E2 side in mm only if the ThermalPadExists is True.

PowerBarsExist

Yes

True, False

True if power bars exist, otherwise false.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment.

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

QFN-2ROW - Quad Flat Pack No Lead, 2 Rows, Square Type

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Dmin, Dmax

Yes

Real

Minimum and maximum body span ranges in mm.

Emin, Emax

Yes

Real

Minimum and maximum body span ranges in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length ranges in mm.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum standoff height in mm.

Pitch1

Yes

Real

The distance between two pins on the outer row of the package in mm.

Pitch

Yes

Real

The distance between two inner pins on the inner row of the package in mm.

ThermalPadExists

Yes

True, False

If this field contains a True then D2 fields are required to define thermal pad. If this field is blank/False then D2 fields are not required.

D2min, D2max

Optional

Real

Specify the minimum and maximum thermal pad ranges on D2 side in mm units only if the ThermalPadExists field is True.

PinCount

Yes

Integer

The total number of pins for this package.

CalculateNrefs

Yes

True, False

If True, then ND_OuterRow, ND-InnerRow, NE-OuterRow and NE-InnerRow fields need to be defined. If False,
then these fields are not to be defined.

ND-OuterRow

Optional

Integer

The number of pins on the outer ND side.

NE-OuterRow

Optional

Integer

The number of pins on the outer NE side.

ND-InnerRow

Optional

Integer

The number of pins on the inner ND side.

NE-InnerRow

Optional

Integer

The number of pins on the inner NE side.

DensityLevel

Yes

L, M, N

M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment.

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOIC - Small Outline Integrated Package with 1.27mm Pitch - Gullwing Leads

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Hmin, Hmax

Yes

Real

Minimum and maximum width ranges in mm.

Smin, Smax

No

Real

Minimum and maximum heel spacings in mm. By default, the heel spacing is calculated by subtracting twice the maximum Lead length Range from the Minimum Body Width Range.

Bmin, Bmax

Yes

Real

Minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum lead length ranges in mm.

Emin, Emax

Yes

Real

Minimum and maximum body widths in mm.

Dmin, Dmax

Yes

Real

Minimum and maximum body lengths in mm.

Amax

Yes

Real

Minimum height in mm.

A1min

Yes

Real

Minimum standoff height in mm.

PinCount

Yes

Integer

Number of pins for this SOIC package.

AbsentPins

Yes

String

If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5.

ThermalPadExists

Yes

True, False

If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/False then D2/E2 fields are not required.

D2min, D2max

No

Real

Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True.

E2min, E2max

No

Real

Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True.

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOJ - Small Outline Package with J Leads

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Emin,Emax

Yes

Real

Minimum and maximum width ranges in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum lead length range in mm.

E1max

Yes

Real

Maximum body width in mm.

Dmax

Yes

Real

Maximum body length in mm.

Amax

Yes

Real

Maximum height of the package in mm.

A1min

Yes

Real

Minimum standoff height in mm.

PinCount

Yes

Integer

Number of pads for the package.

AbsentPins

Yes

String

If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5.

Pitch

Yes

Real

The pitch (e) is the distance between any two pins of the package in mm.

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L
= Least Use Environment (Level C - High Density).

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOP - Small Outline Package with Gullwing Leads

Name

Req ' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Hmin, Hmax

Yes

Real

The minimum width range in mm.

Bmin, Bmax

Yes

Real

Minimum and maximum lead (pin) width ranges in mm.

Lmin, Lmax

Yes

Real

Minimum and maximum lead (pin) length ranges in mm.

Emax

Yes

Real

Maximum body width of the package in mm.

Dmax

Yes

Real

Maximum body length of the package in mm.

Amax

Yes

Real

Maximum height of the package in mm.

A1min

Yes

Real

Minimum standoff height in mm.

PinCount

Yes

Integer

The number of pins for this package.

AbsentPins

Yes

String

A sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. If blank no pins are absent.

Pitch

Yes

Real

The distance between two pins (leads) on this package.

ThermalPadExists

Yes

True, False

If this field is True then D2/E2 fields are required to define thermal pad. If blank/False then D2/E2 fields are not required.

D2min, D2max

Optional

Real

Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True.

E2min,E2max

Optional

Real

Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True.

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOT23 - Small Outline Transistor

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Emin, Emax

Yes

Real

The minimum and maximum lead span ranges in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum width ranges in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length ranges in mm.

E1min, E1max

Yes

Real

The minimum and maximum body width ranges of the package in mm.

Dmin, Dmax

Yes

Real

The minimum and maximum body length range of the package in mm.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum standoff height of the package in mm.

PinCount

Yes

Integer

The number of leads (pins) for this package.

PinOrder

Yes

String

Comma separated string specifies pin ordering. Eg 1,2,3 for 3 pin version. 5 or 6 lead versions have this field blank as it is assumed to be 1,2,3,4,5 or 1,2,3,4,5,6.

Pitch

Yes

Real

The distance between the unary pin on the opposite side and a pin on the other side in mm.

Pitch1

Yes

Real

The distance between two pins on the same side in mm.

DensityLevel

Yes

L, M, N

M = Most Use Environment (, N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOT89 - Small Outline Transistor

Name

Req'd

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

PackageType

Yes

143, 343

143 corresponds to SOT143 and 343 corresponds to SOT343.

Emin, Emax

Yes

Real

The minimum and maximum body width ranges of the package in mm.

Dmin, Dmax

Yes

Real

The minimum and maximum body length ranges in mm.

Amax

Yes

Real

The maximum height of the package in mm.

ReversePins

Yes

Boolean

If Pins need to be reversed, Set to TRUE. Otherwise leave field blank.

Hmin, Hmax

Yes

Real

The minimum and maximum lead span ranges in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum lead width ranges in mm.

B1min, B1max

Yes

Real

The minimum and maximum center lead width ranges in mm.

D1min, D1max

Yes

Real

The minimum and maximum tab width range in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length range of the package in mm.

H1min, H1max

Yes

Real

The minimum and maximum tab length ranges in mm.

Pitch

Yes

Real

Distance between two thin leads.

DensityLevel

Yes

L, M, N

M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro.

JHmin

Optional

Real

Minimum value for the heel fillet.

JS1min, JS2min, JS3min

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

SOT143/343 - Small Outline Transistor

Name

Req' d

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

PackageType

Yes

143, 343

The value 143 corresponds to SOT143 and this 343 corresponds to SOT343.

Emin, Emax

Yes

Real

The minimum and maximum lead span ranges of the package in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum thin lead width ranges in mm.

B2min, B2max

Yes

Real

The minimum and maximum thick lead width ranges in mm.

E1min, E1max

Yes

Real

The minimum and maximum body width ranges in mm.

Dmin, Dmax

Yes

Real

The minimum and maximum body length ranges in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length range of the package in mm.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum stand off height in mm.

PinOrder

Yes

String

Comma separated string which denotes the order of pins. Eg 1,2,3.

Pitch

Yes

Real

Distance between two thin leads.

Pitch1 (e1)

Yes

Real

Distance between thick n thin leads on the same side.

PitchOffset

Yes

Real

Distance between thick n thin leads on opposite sides.

CalculatePitch1

Yes

String

If True, then the PitchOffset is used to calculate Pitch1. If blank, Pitch1 only.

LargePinCount

Yes

Integer

LargePinCount is 1 or 2. If LargePinCount = 2, top left/top right pins set large.

LargePinLocation

Yes

String

LargePinLocation (when LargePinCount = 1) is TL, BL, BR or TR for 'Top left','Bottom left', 'Bottom right', and 'Top right' respectively.

DensityLevel

Yes

L, M, N

M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro.

 

JHmin

Optional

Real

Minimum value for the heel fillet.

 

JSmin

Optional

Real

Minimum value for the side fillet.

 

JTmin

Optional

Real

Minimum value for the toe fillet.

SOT223 - Small Outline Transistor

Name

Req'd

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Emin, Emax

Yes

Real

The minimum and maximum lead span ranges in mm.

Bmin, Bmax

Yes

Real

The minimum and maximum lead width ranges in mm.

Lmin, Lmax

Yes

Real

The minimum and maximum lead length ranges in mm.

E1min, E1max

Yes

Real

The minimum and maximum body width ranges in mm.

Dmin, Dmax

Yes

Real

The minimum and maximum body length ranges in mm.

B2min, B2max

Yes

Real

The minimum and maximum tab width ranges in mm.

Amax

Yes

Real

The maximum height of the package in mm.

A1min

Yes

Real

The minimum standoff height in mm.

Nref

Yes

Integer

The number of leads (including tab).

Pitch

Yes

Real

The length between two normal adjacent leads (not the tab lead) in mm.

Pitch1

Yes

Real

The length between the extremes of normal leads ie the first and the last normal leads on the same side of the package in mm.

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

 

JHmin

Optional

Real

Minimum value for the heel fillet.

 

JSmin

Optional

Real

Minimum value for the side fillet.

 

JTmin

Optional

Real

Minimum value for the toe fillet.

Wire Wound - Precision Wire Wound Inductor, 2 Pins

Name

Req'd

Format

Description

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used.

FootprintDescription

Optional

String

If blank, then description is auto-generated.

Lmin, Lmax

Yes

Real

The minimum and maximum body length ranges in mm.

Wmin, Wmax

Yes

Real

The minimum and maximum body width ranges in mm.

Tmin, Tmax

Yes

Real

The minimum and maximum lead length ranges in mm.

Twmin, Twmax

Yes

Real

The minimum and maximum lead width width ranges in mm.

Amax

Yes

Real

The maximum height of the package in mm.

Positive

Yes

0,1,2

The specified pin location that has the positive polarity. 0 denotes no polarity.

DensityLevel

Yes

L, M, N

M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density).

JHmin

Optional

Real

Minimum value for the heel fillet.

JSmin

Optional

Real

Minimum value for the side fillet.

JTmin

Optional

Real

Minimum value for the toe fillet.

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