XC3S1400AN-4FGG676C - Feature Summary

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Figure 1. Xilinx Spartan-3AN FPGA
(XC3S1400AN-4FGG676C).

The XC3S1400AN-4FGG676C device is a member of the Spartan-3AN family of FPGAs. The Spartan-3AN provides a low-cost, high-density solution for applications such as those targeted to the consumer electronics industry.

The entire Spartan-3AN family includes five devices offering densities ranging from 50,000 to 1,400,000 gates. The XC3S1400AN-4FGG676C offers 1.4 million gates. Table 1 provides an information summary for this device.
 

In order to use the Spartan-3AN device, you will need to install the relevant Vendor tools – Xilinx® ISE™ or Xilinx ISE WebPACK® from www.xilinx.com.


Table 1. Feature summary for the Spartan-3AN FPGA device.
Feature
Description

Device Name

XC3S1400AN-4FGG676C

Vendor

Xilinx

Family

Spartan-3AN

Package

676-Ball Fine Pitch Ball Grid Array (FG676)

Speed Grade

Standard

Temperature Grade

Commercial

Pin Count

676

Maximum User I/O Pins

502 (includes a maximum of 94 Input-only pins)

Max. Differential I/O Pairs

227

System Gates

1,400,000

Xilinx Logic Cells

25,344

CLB Array

2,816 CLBs (72 rows by 40 columns). (1 CLB = 4 Slices, giving 11,264 Slices).

Embedded (Block) RAM

576K bits

Distributed RAM

176K bits

Embedded Multipliers (18x18)

32

Digital Clock Managers (DCM)

8

Global Clock Resources

16

Configuration Memory Required

4,755,296 bits

On-Chip Termination Support

Yes

Further Device Information

For more information on the XC3S1400AN-4FGG676C device, refer to the datasheet (ds557.pdf) and associated user guide (ug331.pdf) available at www.xilinx.com.

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