XC3S1400AN-4FGG676C - Feature Summary
The XC3S1400AN-4FGG676C device is a member of the Spartan-3AN family of FPGAs. The Spartan-3AN provides a low-cost, high-density solution for applications such as those targeted to the consumer electronics industry.
The entire Spartan-3AN family includes five devices offering densities ranging from 50,000 to 1,400,000 gates. The XC3S1400AN-4FGG676C offers 1.4 million gates. Table 1 provides an information summary for this device.
In order to use the Spartan-3AN device, you will need to install the relevant Vendor tools – Xilinx® ISE™ or Xilinx ISE WebPACK® from www.xilinx.com.
Feature | Description |
---|---|
Device Name | XC3S1400AN-4FGG676C |
Vendor | Xilinx |
Family | Spartan-3AN |
Package | 676-Ball Fine Pitch Ball Grid Array (FG676) |
Speed Grade | Standard |
Temperature Grade | Commercial |
Pin Count | 676 |
Maximum User I/O Pins | 502 (includes a maximum of 94 Input-only pins) |
Max. Differential I/O Pairs | 227 |
System Gates | 1,400,000 |
Xilinx Logic Cells | 25,344 |
CLB Array | 2,816 CLBs (72 rows by 40 columns). (1 CLB = 4 Slices, giving 11,264 Slices). |
Embedded (Block) RAM | 576K bits |
Distributed RAM | 176K bits |
Embedded Multipliers (18x18) | 32 |
Digital Clock Managers (DCM) | 8 |
Global Clock Resources | 16 |
Configuration Memory Required | 4,755,296 bits |
On-Chip Termination Support | Yes |
Further Device Information
For more information on the XC3S1400AN-4FGG676C device, refer to the datasheet (ds557.pdf
) and associated user guide (ug331.pdf
) available at www.xilinx.com.