IPC-Compliant Batch Footprint Generator Reference
Contents
- Function
- Content and Use
- IPC Compliant Footprint Batch Generator Component Types
- Package Dimensional Data and Type Summary
- Heel, Side and Toe Fillets Information
- Land Pattern Information
- BGA - Ball Grid Array
- BQFP - Bumpered Quad Flat Pack
- CFP - Ceramic Dual Flat Pack - Trimmed and Formed Gullwing Leads
- Chip - Capacitor / Inductor / Resistor
- CQFP - Ceramic Quad Flat Pack with Trimmed and Formed Gullwing Leads
- DPAK - Transistor Outline
- LCC - Leadless Chip Carrier
- MELF Component - Diode / Resistor
- Molded Component - Inductor / Capacitor / Diode
- PLCC - Plastic Leaded Chip Carrier Square with J Leads
- PQFP - Plastic Quad Flat Pack
- QFN - Quad Flat Pack No Lead Type
- QFN-2ROW - Quad Flat Pack No Lead, 2 Rows, Square Type
- SOIC - Small Outline Integrated Package with 1.27mm Pitch - Gullwing Leads
- SOJ - Small Outline Package with J Leads
- SOP - Small Outline Package with Gullwing Leads
- SOT23 - Small Outline Transistor
- SOT89 - Small Outline Transistor
- SOT143/343 - Small Outline Transistor
- SOT223 - Small Outline Transistor
- Wire Wound - Precision Wire Wound Inductor, 2 Pins
This reference provides technical information on configuring and using the IPC® Compliant Footprints Batch Generator to generate IPC compliant footprints in a PCB library document.
Building IPC compliant footprints from datasheet package information files quickly and easily is made possible by the use of the IPC Compliant Footprints Batch Generator.
The generator reads the datasheet package information (dimensional data of electronic components) from Excel spreadsheets or comma delimited files and then applies the IPC equations to build IPC compliant footprints.
Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data. The spreadsheet is then fed into the generator to build IPC compliant footprints in PCB libraries.
The following sections of this reference detail the dimensional data of each component package type for the Altium Designer's IPC Compliant Footprints Batch Generator.
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Function
Figure 1. The IPC® Compliant Footprints Batch generator dialog.
The IPC Compliant Footprints Batch generator allows you to generate footprint package kinds in PCB library files (*.PCBLIB) from input files, which can be Excel workbooks or comma delimited files. Such files must contain formatted component dimensional data. You can use the blank template files from the Template folder as the starting point. You then generate batches of footprints according to their footprint name (package kind) in the table.
Content and Use
Make a copy of the required blank template files and fill in the fields for each package that need to have corresponding footprints generated. Details of the dimensional information are mandatory and which is optional, as well as references to the dimensions they represent on the package are outlined in the respective footprint sections below.
Then you can select the Tools»IPC Compliant Footprints Batch generator menu item in the PCB Library editor to launch the generator. Once the generator dialog is displayed, you can then add input package type files by clicking the Add Files button to select package input files, or drag and drop the files directly onto the dialog. Set the output folder to a suitable location.
You also have the option of generating all footprints in a footprint library, a single PCB library document per input file, or an individual PCB library per footprint name. The Generate single PcbLib files per input file option will generate a PcbLib in the output folder with the same name as the input file being processed, and the footprints from this file will be put into the Pcblib. The Generate single PcbLib files per footprint name option will generate a PcbLib in the output folder for every package in the input files; either from the FootprintName package field, or using the generated IPC naming convention name if the field is blank.
Click the Start button to process the input files and then the PcbLib files and footprints generated. To stop and close the batch process, click the Stop button or the Close button.
If the Generate report on completion option is selected, then a report in HTML format will be generated and displayed containing the processed files, and any errors or warnings generated.
IPC Compliant Footprint Batch Generator Component Types
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Package Dimensional Data and Type Summary
Component package data is illustrated by its physical image, its dimensional image and a table outlining the package's dimensional data such as its name, its format type and its function in tables as described in each package below.
Component package data are in metric (mm) measurement units only and is stored in an Excel file or a CSV text file and such files should contain data related to the specific package type only. Blank templates for package type files are provided in the Templates folder of your Altium Designer installation. These templates can be used as a starting point to enter component dimensional data.
The first two lines in a package data template file correspond to the specific component package kind. For example, the BQFP (Bumpered Quad Flat Pack).xls file represents the BQFP package type. See an example of the BQFP data below.
| BQFP |
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| FootprintName | FootprintDescription | D1min | D1max | Dmin | Dmax | Lmin | Lmax | Pitch | Amax | A1min |
| BQFPS-44M |
| 10.23 | 10.23 | 13.35 | 13.58 | 0.51 | 0.76 | 0.635 | 2.54 | 0.01 |
| BQFPS-44M |
| 11.5 | 11.5 | 14.61 | 14.85 | 0.51 | 0.76 | 0.635 | 2.54 | 0.01 |
| BQFPS-68M |
| 14.04 | 14.04 | 17.15 | 17.39 | 0.51 | 0.76 | 0.635 | 2.54 | 0.01 |
| BQFPS-84M |
| 16.58 | 16.58 | 19.69 | 19.93 | 0.51 | 0.76 | 0.635 | 2.54 | 0.01 |
Heel, Side and Toe Fillets Information
Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.
Note, that the fillet fields are optional for defining a package's dimensional data. If all the fillet fields are defined, then the generator will try and use these fields. However if there are one or more fields, but not all fillet fields are missing, or any of the fillet fields have invalid values in them, then the automatically calculated solder fillet values will be used instead.
The following packages have such fillets;
BQFP, Chip, CFP, CQFP, DPAK, LCC, MELF, Molded Capacitor/Diode/Inductor, PLCC, PQFP, QFN, QFN-2ROW, SOIC, SOJ, SOP, SOT23, SOT89, SOT143/343, SOT223 and Wirewound packages.
Land Pattern Information
Density Level A: Maximum (Most) Land Protrusion - For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull-wing devices. The geometry representing these devices, and inward and ''J''-formed lead contact device families, may provide a wider process window for reflow solder processes.
Density Level B: Median (Nominal) Land Protrusion - Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.
Density Level C: Minimum (Least) Land Protrusion - High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly.
For example, for those packages that have density level fields in package sections below, a typical table entry would look like this;
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
BGA - Ball Grid Array
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Dmin, Dmax | Yes | Real | Minimum and maximum Body Length ranges in mm. |
| D1ave | Yes | Real | Nominal Row Grid length of the package in mm. |
| Emin, Emax | Yes | Real | Minimum and maximum Body Width Ranges in mm. |
| E1ave | Yes | Real | Nominal column grid width of the package in mm. |
| A1min | Yes | Real | Minimum Standoff Height. |
| Amax | Yes | Real | Maximum Height. |
| Bnom | Yes | Real | Nominal ball diameter. |
| Pitch | Yes | Real | The pitch between any two pins in mm. |
| GridType | Yes | P, S | P = Plain Grid or S = Staggered Grid |
| MatrixType | Yes | F, P, SD, TE | F = Full Matrix, P = Perimeter, SD =.Selectively Depopulated, TE = Thermally Enhanced. |
| Rows | Yes | Integer | Number of rows for the grid. |
| Columns | Yes | Integer | Number of columns for the grid. |
| Nm | Yes | Integer | Maximum number of balls for this BGA package. |
| Np | Yes | Integer | The Np field is the actual number of balls available for this BGA package especially when the BGA is depopulated. It is not uncommon to have BGA packages with ball gaps. Np is always equal or less than Nm. |
BQFP - Bumpered Quad Flat Pack
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| D1min, D1max | Yes | Real | Minimum and maximum body length ranges in mm. |
| Dmin, Dmax | Yes | Real | Minimum and maximum lead span ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum lead length range in mm. |
| Pitch | Yes | Real | Distance between any two leads in mm. |
| Amax | Yes | Real | Maximum height in mm. |
| A1min | Yes | Real | Minimum standoff height in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum Lead Width range in mm. |
| Nref | Yes | Integer | Number of leads for this package. |
| Pin1 | Yes | S,C | S = Corner of Left Side or C = Center of Top Side. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
CFP - Ceramic Dual Flat Pack - Trimmed and Formed Gullwing Leads
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Dmax | Yes | Real | Minimum and maximum body length in mm. |
| E1max | Yes | Real | Minimum and maximum body width in mm. |
| A | Yes | Real | Maximum height in mm. |
| A1 | Yes | Real | Minimum stand off height in mm. |
| BMin, BMax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Pitch | Yes | Real | The distance between the centres of two pins of the package in mm. |
| Dfmin, Dfmax | Yes | Real | Minimum and maximum lead span ranges in mm. |
| Lfmin, Lfmax | Yes | Real | Minimum and maximum lead length ranges in mm. |
| PinCount | Yes | Integer | Number of pins for this package. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JTmin | Optional | Real | Minimum value for the heel fillet. |
| JHmin | Optional | Real | Minimum value for the side fillet. |
| JSmin | Optional | Real | Minimum value for the toe fillet. |
Chip - Capacitor / Inductor / Resistor
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Lmin, Lmax | Yes | Real | Minimum and maximum Body Length Ranges in mm. |
| Wmin, Wmax | Yes | Real | Minimum and maximum Width Length Ranges in mm. |
| Tmin, Tmax | Yes | Real | Minimum and maximum Bandwidth Ranges in mm. |
| Amax | Yes | Real | Maximum height in mm. |
| PackageType | Yes | C,I,R | C = Chip Capacitor, I = Chip Inductor or R = Chip Resistor. |
| PositivePin | Yes | Blank, 1, 2 | If the chip is an Inductor or Capacitor or then need to specify Positive Pin and these types have only two pins. Blank = None, 1 = Pin 1 or 1 = Pin 2. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JTmin | Optional | Real | Minimum value for the heel fillet. |
| JHmin | Optional | Real | Minimum value for the side fillet. |
| JSmin | Optional | Real | Minimum value for the toe fillet. |
CQFP - Ceramic Quad Flat Pack with Trimmed and Formed Gullwing Leads
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| D1min, D1max | Yes | Real | Minimum and maximum body ranges in mm. |
| Pitch | Yes | Real | Distance between any two leads of this package. |
| Amax | Yes | Real | Maximum height of package in mm. |
| A1min | Yes | Real | Minimum standoff height in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| PinCount | Yes | Integer | Number of leads for this component package. |
| Pin1 | Yes | C, S | C = Centre of top side or S = Corner of Left Side of the package. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
DPAK - Transistor Outline
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Hmin, HMax | Yes | Real | Minimum and maximum Length ranges in mm. |
| B1min, B1max | Yes | Real | Minimum and maximum lead width range in mm. |
| Dmax | Yes | Real | Maximum body length in mm. |
| L2min, L2max | Yes | Real | Minimum and maximum tab length ranges in mm. |
| Emax | Yes | Real | Maximum body width in mm. |
| L1min, L1max | Yes | Real | Minimum and maximum lead length ranges in mm. |
| L3min | Yes | Real | Minimum tab overhang in mm. |
| B2min, B2max | Yes | Real | Minimum and maximum tab width ranges in mm. |
| Amax | Yes | Real | Maximum height of package in mm. |
| A1min | Yes | Real | Minimum Standoff height in mm. |
| PinCount | Yes | Integer | The number of pins for this package. |
| TabNumber | Yes | String | The name for the tab. |
| TrimmedPins | Yes | String | Comma text string with pin names that are to be trimmed. Eg 1,2,3. |
| Pitch | Yes | Real | The distance between a pin and the short pin of the DPAK package. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JH1min, J2min | Optional | Real | Minimum values for the first and second heel fillets. |
| JS1min, JS2min | Optional | Real | Minimum values for the first and second side fillets. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
LCC - Leadless Chip Carrier
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Emin, Emax | Yes | Real | Minimum and maximum body width ranges in mm. |
| Dmin, Dmax | Yes | Real | Minimum and maximum body length ranges in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum pin width ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum pin length ranges in mm. |
| L1min, L1max | Yes | Real | Minimum and maximum length ranges of pin 1 in mm. |
| Amax | Yes | Real | Maximum height of the package in mm. |
| A2max | Yes | Real | Maximum package height in mm (less than Amax). |
| NEref | Yes | Integer | Number of pins on side of E. |
| NDref | Yes | Integer | Number of pins on side of D. |
| Pitch | Yes | Real | Distance between any two pins in mm. |
| Pin1 | Yes | S2, C1 | S2 = Side of D or C1 = Center of E. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
MELF Component - Diode / Resistor
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Lmin, Lmax | Yes | Real | Minimum and maximum body length ranges in mm. |
| Wmin, Wmax | Yes | Real | Minimum and maximum body width ranges in mm. |
| Tmin, Tmax | Yes | Real | Minimum and maximum bandwidth ranges of pin 1 in mm. |
| Cathode | Yes | 1,2 | Required for MELF diodes only. Specify pin 1 or 2 for cathode. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
Molded Component - Inductor / Capacitor / Diode
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Lmin, Lmax | Yes | Real | Minimum and maximum body length ranges in mm. |
| Wmin, Wmax | Yes | Real | Minimum and maximum body width ranges in mm. |
| Tmin, Tmax | Yes | Real | Minimum and maximum lead length ranges in mm. |
| TwMin,TwMax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Amax | Yes | Real | Maximum height of the package in mm. |
| Cathode | Yes | 1,2 | Required for Molded diodes only. Specify pin 1 or 2 for cathode. |
| PositivePin | Yes | 0,1,2 | Required for molded inductor/capacitors only. Specify 0 for none, pin 1 or pin 2. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
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| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
PLCC - Plastic Leaded Chip Carrier Square with J Leads
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| Name | Required | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum stand off height of the package in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum lead width ranges in mm. |
| Dmin, Dmax | Yes | Real | The minimum and maximum lead span ranges in mm. |
| D1min. D1max | Yes | Real | The minimum and maximum lead span ranges in mm. |
| Pitch | Yes | Real | The distance between two leads of the package in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| Nref | Yes | Integer | The number of pins for this package. |
| Pin1 | Yes | S,C | S = Corner of left side, C = Center of Top Side. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
PQFP - Plastic Quad Flat Pack
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Dmin, Dmax | Yes | Real | Minimum and maximum lead span ranges in mm. |
| Emin, Emax | Yes | Real | Minimum and maximum lead span ranges in mm. |
| Emax | Yes | Real | Maximum lead span range in mm. |
| D1min, D1max | Yes | Real | Minimum and maximum lead length ranges in mm. |
| E1min, E1max | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum lead length ranges in mm. |
| Pitch | Yes | Real | Distance between any two leads in mm. |
| Amax | Yes | Real | Maximum Height of the package in mm. |
| A1min | Yes | Real | Minimum Standoff Height in mm. |
| NDref, NEref | Yes | Integer | NDref = number of pins for D side and NEref = no of pins for E side. |
| Pin1 | Yes | S2, C1 | S2 = Side of D or C1 = Center of E. |
| ThermalPadExists | Yes | True, False | If this field contains a True then D2/E2 fields are required to define thermal pad, but if blank/False then D2/E2 fields are not required. |
| D2min, D2max | Optional | Real | Specify the minimum and maximum thermal pad ranges on D2 and E2 sides in mm only if the ThermalPadExists field is True. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment . |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
QFN - Quad Flat Pack No Lead Type
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Dmin, Dmax | Yes | Real | Minimum and maximum body span ranges in mm. |
| Emin, Emax | Yes | Real | Minimum and maximum body span ranges in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum standoff height in mm. |
| A3min, A3max | Yes | Real | The minimum and maximum lead heights in mm. |
| NDref | Yes | Integer | Number of pins on E side of the package. |
| NEref | Yes | Integer | Number of pins on D side of the package. |
| Pitch | Yes | Real | The distance between two pins of the package in mm. |
| Pin1 | Yes | S2, C1 | S2= Side of D or C1= Center of E. |
| ThermalPadExists | Yes | True, False | If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/False then D2/E2 fields are not required. |
| D2min, D2max | Optional | Real | Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. |
| E2min, E2Max | Optional | Real | Specify the minimum and maximum thermal pad range on E2 side in mm only if the ThermalPadExists is True. |
| PowerBarsExist | Yes | True, False | True if power bars exist, otherwise false. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
QFN-2ROW - Quad Flat Pack No Lead, 2 Rows, Square Type
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Dmin, Dmax | Yes | Real | Minimum and maximum body span ranges in mm. |
| Emin, Emax | Yes | Real | Minimum and maximum body span ranges in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum standoff height in mm. |
| Pitch1 | Yes | Real | The distance between two pins on the outer row of the package in mm. |
| Pitch | Yes | Real | The distance between two inner pins on the inner row of the package in mm. |
| ThermalPadExists | Yes | True, False | If this field contains a True then D2 fields are required to define thermal pad. If this field is blank/False then D2 fields are not required. |
| D2min, D2max | Optional | Real | Specify the minimum and maximum thermal pad ranges on D2 side in mm units only if the ThermalPadExists field is True. |
| PinCount | Yes | Integer | The total number of pins for this package. |
| CalculateNrefs | Yes | True, False | If True, then ND_OuterRow, ND-InnerRow, NE-OuterRow and NE-InnerRow fields need to be defined. If False, |
| ND-OuterRow | Optional | Integer | The number of pins on the outer ND side. |
| NE-OuterRow | Optional | Integer | The number of pins on the outer NE side. |
| ND-InnerRow | Optional | Integer | The number of pins on the inner ND side. |
| NE-InnerRow | Optional | Integer | The number of pins on the inner NE side. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment, N = Nominal Use Environment, L = Least Use Environment. |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOIC - Small Outline Integrated Package with 1.27mm Pitch - Gullwing Leads
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| Name | Req' d | Format | Description |
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| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Hmin, Hmax | Yes | Real | Minimum and maximum width ranges in mm. |
| Smin, Smax | No | Real | Minimum and maximum heel spacings in mm. By default, the heel spacing is calculated by subtracting twice the maximum Lead length Range from the Minimum Body Width Range. |
| Bmin, Bmax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum lead length ranges in mm. |
| Emin, Emax | Yes | Real | Minimum and maximum body widths in mm. |
| Dmin, Dmax | Yes | Real | Minimum and maximum body lengths in mm. |
| Amax | Yes | Real | Minimum height in mm. |
| A1min | Yes | Real | Minimum standoff height in mm. |
| PinCount | Yes | Integer | Number of pins for this SOIC package. |
| AbsentPins | Yes | String | If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. |
| ThermalPadExists | Yes | True, False | If this field contains a True then D2/E2 fields are required to define thermal pad. If this field is blank/False then D2/E2 fields are not required. |
| D2min, D2max | No | Real | Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. |
| E2min, E2max | No | Real | Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOJ - Small Outline Package with J Leads
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|
|
| Name | Req' d | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Emin,Emax | Yes | Real | Minimum and maximum width ranges in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum lead length range in mm. |
| E1max | Yes | Real | Maximum body width in mm. |
| Dmax | Yes | Real | Maximum body length in mm. |
| Amax | Yes | Real | Maximum height of the package in mm. |
| A1min | Yes | Real | Minimum standoff height in mm. |
| PinCount | Yes | Integer | Number of pads for the package. |
| AbsentPins | Yes | String | If blank no pins are absent. Otherwise a sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. |
| Pitch | Yes | Real | The pitch (e) is the distance between any two pins of the package in mm. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOP - Small Outline Package with Gullwing Leads
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|
|
| Name | Req ' d | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Hmin, Hmax | Yes | Real | The minimum width range in mm. |
| Bmin, Bmax | Yes | Real | Minimum and maximum lead (pin) width ranges in mm. |
| Lmin, Lmax | Yes | Real | Minimum and maximum lead (pin) length ranges in mm. |
| Emax | Yes | Real | Maximum body width of the package in mm. |
| Dmax | Yes | Real | Maximum body length of the package in mm. |
| Amax | Yes | Real | Maximum height of the package in mm. |
| A1min | Yes | Real | Minimum standoff height in mm. |
| PinCount | Yes | Integer | The number of pins for this package. |
| AbsentPins | Yes | String | A sequence of pin numbers separated by a comma that are required to be absent from the package for example 1,2,5. If blank no pins are absent. |
| Pitch | Yes | Real | The distance between two pins (leads) on this package. |
| ThermalPadExists | Yes | True, False | If this field is True then D2/E2 fields are required to define thermal pad. If blank/False then D2/E2 fields are not required. |
| D2min, D2max | Optional | Real | Specify the minimum and maximum thermal pad ranges on D2 side in mm only if the ThermalPadExists field is True. |
| E2min,E2max | Optional | Real | Specify the minimum and maximum thermal pad ranges on E2 side in mm only if the ThermalPadExists is True. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOT23 - Small Outline Transistor
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|
|
| Name | Req' d | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Emin, Emax | Yes | Real | The minimum and maximum lead span ranges in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum width ranges in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| E1min, E1max | Yes | Real | The minimum and maximum body width ranges of the package in mm. |
| Dmin, Dmax | Yes | Real | The minimum and maximum body length range of the package in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum standoff height of the package in mm. |
| PinCount | Yes | Integer | The number of leads (pins) for this package. |
| PinOrder | Yes | String | Comma separated string specifies pin ordering. Eg 1,2,3 for 3 pin version. 5 or 6 lead versions have this field blank as it is assumed to be 1,2,3,4,5 or 1,2,3,4,5,6. |
| Pitch | Yes | Real | The distance between the unary pin on the opposite side and a pin on the other side in mm. |
| Pitch1 | Yes | Real | The distance between two pins on the same side in mm. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (, N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOT89 - Small Outline Transistor
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|
|
| Name | Req'd | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| PackageType | Yes | 143, 343 | 143 corresponds to SOT143 and 343 corresponds to SOT343. |
| Emin, Emax | Yes | Real | The minimum and maximum body width ranges of the package in mm. |
| Dmin, Dmax | Yes | Real | The minimum and maximum body length ranges in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| ReversePins | Yes | Boolean | If Pins need to be reversed, Set to TRUE. Otherwise leave field blank. |
| Hmin, Hmax | Yes | Real | The minimum and maximum lead span ranges in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum lead width ranges in mm. |
| B1min, B1max | Yes | Real | The minimum and maximum center lead width ranges in mm. |
| D1min, D1max | Yes | Real | The minimum and maximum tab width range in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length range of the package in mm. |
| H1min, H1max | Yes | Real | The minimum and maximum tab length ranges in mm. |
| Pitch | Yes | Real | Distance between two thin leads. |
| DensityLevel | Yes | L, M, N | M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro. |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JS1min, JS2min, JS3min | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOT143/343 - Small Outline Transistor
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| Name | Req' d | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| PackageType | Yes | 143, 343 | The value 143 corresponds to SOT143 and this 343 corresponds to SOT343. |
| Emin, Emax | Yes | Real | The minimum and maximum lead span ranges of the package in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum thin lead width ranges in mm. |
| B2min, B2max | Yes | Real | The minimum and maximum thick lead width ranges in mm. |
| E1min, E1max | Yes | Real | The minimum and maximum body width ranges in mm. |
| Dmin, Dmax | Yes | Real | The minimum and maximum body length ranges in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length range of the package in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum stand off height in mm. |
| PinOrder | Yes | String | Comma separated string which denotes the order of pins. Eg 1,2,3. |
| Pitch | Yes | Real | Distance between two thin leads. |
| Pitch1 (e1) | Yes | Real | Distance between thick n thin leads on the same side. |
| PitchOffset | Yes | Real | Distance between thick n thin leads on opposite sides. |
| CalculatePitch1 | Yes | String | If True, then the PitchOffset is used to calculate Pitch1. If blank, Pitch1 only. |
| LargePinCount | Yes | Integer | LargePinCount is 1 or 2. If LargePinCount = 2, top left/top right pins set large. |
| LargePinLocation | Yes | String | LargePinLocation (when LargePinCount = 1) is TL, BL, BR or TR for 'Top left','Bottom left', 'Bottom right', and 'Top right' respectively. |
| DensityLevel | Yes | L, M, N | M = Most Use Enviro, N = Nominal Use Enviro, L = Least Use Enviro. |
|
| JHmin | Optional | Real | Minimum value for the heel fillet. |
|
| JSmin | Optional | Real | Minimum value for the side fillet. |
|
| JTmin | Optional | Real | Minimum value for the toe fillet. |
SOT223 - Small Outline Transistor
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|
|
|
| Name | Req'd | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Emin, Emax | Yes | Real | The minimum and maximum lead span ranges in mm. |
| Bmin, Bmax | Yes | Real | The minimum and maximum lead width ranges in mm. |
| Lmin, Lmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| E1min, E1max | Yes | Real | The minimum and maximum body width ranges in mm. |
| Dmin, Dmax | Yes | Real | The minimum and maximum body length ranges in mm. |
| B2min, B2max | Yes | Real | The minimum and maximum tab width ranges in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| A1min | Yes | Real | The minimum standoff height in mm. |
| Nref | Yes | Integer | The number of leads (including tab). |
| Pitch | Yes | Real | The length between two normal adjacent leads (not the tab lead) in mm. |
| Pitch1 | Yes | Real | The length between the extremes of normal leads ie the first and the last normal leads on the same side of the package in mm. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
|
| JHmin | Optional | Real | Minimum value for the heel fillet. |
|
| JSmin | Optional | Real | Minimum value for the side fillet. |
|
| JTmin | Optional | Real | Minimum value for the toe fillet. |
Wire Wound - Precision Wire Wound Inductor, 2 Pins
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|
|
| Name | Req'd | Format | Description |
|---|---|---|---|
| FootprintName | Optional | String | If blank, then auto-generated IPC naming will be used. |
| FootprintDescription | Optional | String | If blank, then description is auto-generated. |
| Lmin, Lmax | Yes | Real | The minimum and maximum body length ranges in mm. |
| Wmin, Wmax | Yes | Real | The minimum and maximum body width ranges in mm. |
| Tmin, Tmax | Yes | Real | The minimum and maximum lead length ranges in mm. |
| Twmin, Twmax | Yes | Real | The minimum and maximum lead width width ranges in mm. |
| Amax | Yes | Real | The maximum height of the package in mm. |
| Positive | Yes | 0,1,2 | The specified pin location that has the positive polarity. 0 denotes no polarity. |
| DensityLevel | Yes | L, M, N | M = Most Use Environment (Level A - Low Density), N = Nominal Use Environment (Level B - Medium density), L = Least Use Environment (Level C - High Density). |
| JHmin | Optional | Real | Minimum value for the heel fillet. |
| JSmin | Optional | Real | Minimum value for the side fillet. |
| JTmin | Optional | Real | Minimum value for the toe fillet. |