IPC-7351B Compliance

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Altium Designer 14.3 incorporates a number of additions and enhancements to both the IPC®-Compliant Footprint Wizard, and the IPC®-Compliant Footprints Batch Generator. These changes are aimed at making both truly compliant with Revision B of the IPC standard 7351 - Generic Requirements for Surface Mount Design and Land Pattern Standard.

IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).

The following additional packages are now supported: CAPAE, CHIP ARRAY, DFN, LGA, PQFN, PSON, SODFL, SON, and SOTFL. In addition, existing packages have been reviewed and modified with respect to data required and/or terminology, with graphics enhanced to better illustrate the application of that data.

Three further beneficial enhancements have also been added in this release:

  • Splitting of the paste mask into small fills, for packages with a large thermal pad (sized 2.1mm x 1.6mm, or larger).
  • For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending under the package's body.
  • For small packages having a large central thermal pad (PQFP, QFN, SOIC, SOP), the peripheral pads are trimmed to ensure required clearance between the pads, in accordance with the IPC Standard.
Where pad trimming is applied, a warning is displayed in the IPC®-Compliant Footprint Wizard, or in the report generated from the IPC®-Compliant Footprints Batch Generator.

Create PCB library components compliant with IPC standard 7351B - individually, or en-masse - using the enhanced IPC®-Compliant Footprint Wizard and IPC®-Compliant Footprints Batch Generator.

Newly Supported Packages

The following sections detail the new packages introduced in Altium Designer 14.3, and supported in both the IPC-Compliant Footprint Wizard and the IPC-Compliant Footprints Batch Generator.

Previously existing packages have been modified, where necessary, to comply with the IPC-7351B standard. Consult the legends in the underlying Excel templates (accessed from the Open Template menu in the IPC-Compliant Footprints Batch Generator dialog), for the current data sets for each of those packages.

CAPAE

Description: Electrolytic Aluminum Capacitor

Included Packages: CAPAE

Support for CAPAE packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the CAPAE package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to CAPAE Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Lmin, Lmax Yes Real Minimum and maximum lead span
Wmin, Wmax Yes Real Minimum and maximum body width
Tmin, Tmax Yes Real Minimum and maximum length of lead
Twmin, Twmax Yes Real Minimum and maximum width of lead
Amin Optional Real Minimum component height
Amax Yes Real Maximum component height
L1min, L1max Yes Real Minimum and maximum body length
Dmax,Dmin Yes Real Diameter of Body
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
JHmin Optional Real Minimum value for heel fillet
JSmin Optional Real Minimum value for side fillet
JTmin Optional Real Minimum value for toe fillet
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to CAPAE Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Optional Real Distance between pads. Measured from outside edges
G Optional Real Distance between pads. Measured from inside edges
X Optional Real Pad width
Y Optional Real Pad length
C Optional Real Row spacing. Distance between pad centers
A Optional Real Assembly width
B Optional Real Assembly length
V1 Optional Real Courtyard width
V2 Optional Real Courtyard length
R1 Optional Real Silkscreen width
R2 Optional Real Silkscreen length

Chip Array

Description: Chip Array

Included Packages: Chip Array, Chip Array Exposed Pad

Support for Chip Array packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the Chip Array package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to Chip Array Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Emin, Emax Yes Real Minimum and maximum body width
Dmin, Dmax Yes Real Minimum and maximum body length (side containing pin 1)
Bmin, Bmax Yes Real Minimum and maximum lead width
B1min, B1max Optional Real Minimum and maximum corner lead width
Lmin, Lmax Yes Real Minimum and maximum lead length
Amax Yes Real Maximum height
Amin Optional Real Minimum height
PinCount Yes Integer Total number of pin positions (including absent pins)
Pitch Yes Real Pitch (e)
PackageType Yes Flat,Concave,ConvexE, ConvexS Type of packge
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
JHmin Optional Real Minimum value for heel fillet.
JSmin Optional Real Minimum value for side fillet.
JTmin Optional Real Minimum value for toe fillet.
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to Chip Array Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Yes Real Distance between pads. Measured from outside edges
C Optional Real Row spacing. Distance between pad centers
G Yes Real Distance between pads. Measured from inside edges
X Yes Real Pad width
X1 Optional Real Corner pad width
Y Yes Real Pad length
A Yes Real Assembly width (E side)
B Yes Real Assembly length (D side)
V1 Yes Real Courtyard width (E side)
V2 Yes Real Courtyard length (D side)
R1 Yes Real Silkscreen width (E side)
R2 Yes Real Silkscreen length (D side)

DFN

Description: Dual Flat No-lead

Included Packages: DFN

Support for DFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the DFN package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to DFN Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Emin, Emax Yes Real Minimum and maximum body width
Dmin, Dmax Yes Real Minimum and maximum body length (side containing pin 1)
b1min, b1max Yes Real Minimum and maximum lead width (small lead)
L1min, L1 max Yes Real Minimum and maximum lead length (small lead)
Amax Yes Real Maximum height
Amin Optional Real Minimum height
A1max Optional Real Maximum standoff height
A1min Yes Real Minimum standoff height
PinCount Yes Integer Total number of pin positions (2,3,4)
e1 Optional Real Pitch (e1)
e2 Yes Real Pitch (e2)
e Optional Real Pitch (e)
b2min, b2max Yes Real Minimum and maximum lead width (big lead)
L2min, L2max Yes Real Minimum and maximum lead length (big lead)
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to DFN Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
A Yes Real Assemble width (D side)
B Yes Real Assemble length (E side)
C Yes Real pads span betwen small one
C1 Yes Real pads span between big and samll one
C2 Yes Real distance from package center to center of big pad
R1 Yes Real Silkscreen width (D side)
R2 Yes Real Silkscreen length (E side)
V1 Yes Real Courtyard width (D side)
V2 Yes Real Courtyard length (E side)
X1 Yes Real Small pad width
Y1 Yes Real Small pad length
X2 Yes Real Big pad width
Y2 Yes Real Big pad length

LGA

Description: Land Grid Array

Included Packages: LGA

Support for LGA packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the LGA package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to LGA Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Dmin, Dmax Yes Real Minimum and maximum body length along D side (A, B, C, ...)
D1ave Yes Real Average length of grid along D side
Emin, Emax Yes Real Minimum and maximum body length along E side (1, 2, 3, ...)
E1ave Yes Real Average length of grid along E side
A1min Yes Real Minimum standoff height
A1max Optional Real Maximum standoff height
A2min, A2max Optional Real Minimum and maximum body height
Amin Optional Real Minimum overall height
Amax Yes Real Maximum overall height
Bnom Yes Real Average lead size
LeadShape Yes R,S Lead shape, round or square
PitchD, PitchE Yes Real Distance between ball centres, in "D" and "E" directions
GridType Yes P, S P = Plain Grid, S = Staggered Grid
MatrixType Yes F, P, SD, TE F = Full Matrix, P = Perimeter, SD = Selectively Depopulated, TE = Thermally Enhanced
Rows Yes Integer Number of balls along D side (A, B, C, ...)
Columns Yes Integer Number of balls along E side (1, 2, 3, ...)
Nmax Yes Integer Maximum number of ball positions (Rows x Columns)
PinCount Yes Integer Number of actual balls present
DepopulateBalls Optional String Ball positions removed from matrix. Example: C5-H10,B6-B9,A1
RepopulateBalls Optional String Ball positions added back into depopulated matrix. Example: C8,D6-F9
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to LGA Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
X Optional Real Diameter of pad.  If specified this overrides the calculated value. This can be used to specify a manufacturer's recommended pad size.
C1 Optional Real  
C2 Optional Real  
A Optional Real Assembly width
B Optional Real Assembly length
V1 Optional Real Courtyard width
V2 Optional Real Courtyard length
R1 Optional Real Silkscreen width
R2 Optional Real Silkscreen length

PQFN

Description: Pulback Quad Flat No-lead

Included Packages: PQFN

Support for PQFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the PQFN package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to PQFN Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Dmin, Dmax Yes Real Minimum and maximum body span on side D
Emin, Emax Yes Real Minimum and maximum body span on side E
Bmin, Bmax Yes Real Minimum and maximum lead width
Lmin, Lmax Yes Real Minimum and maximum lead length
Amin Optional Real Minimum height
Amax Yes Real Maximum height
A1min Yes Real Minimum standoff height
A1max Optional Real Maximum standoff height
L1min, L1max Yes Real Lead pull-back length
PinCountD Yes Integer Number of pins on D side of package
PinCountE Yes Integer Number of pins on E side of package
PitchD Yes Real Distance between two adjacent pins on side D
PitchE Yes Real Distance between two adjacent pins on side E
Pin1 Yes S2, C1 Location of pin 1; S2 = corner of package. C1 = center of package side
D2min, D2max Optional Real Minimum and maximum thermal pad size on D side.  If there is no thermal pad leave this field blank
E2min, E2max Optional Real Minimum and maximum thermal pad size on E side.  If there is no thermal pad leave this field blank
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
Periphery Optional Real Land Periphery
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to PQFN Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
ZE Optional Real Distance between pads. Measured from outside edges
ZD Optional Real Distance between pads. Measured from outside edges
GE Optional Real Distance between pads. Measured from inside edges
GD Optional Real Distance between pads. Measured from inside edges
X Optional Real Pad width
Y Optional Real Pad length
CE Optional Real Row spacing. Distance between pad centers
CD Optional Real Row spacing. Distance between pad centers
E2t Optional Real Thermal Pad width
D2t Optional Real Thermal Pad length
L2 Optional Real Power Bar width.
B2, B3, B4, B5, G3, G4, G5, G6 Optional Real Power Bar length. If all are blank, no power bars are drawn.
A Optional Real Assembly width (E side)
B Optional Real Assembly length (D side)
V1 Optional Real Courtyard width (E side)
V2 Optional Real Courtyard length (D side)
R1 Optional Real Silkscreen width (E side)
R2 Optional Real Silkscreen length (D side)

PSON

Description: Pulback Small Outline No-lead

Included Packages: PSON

Support for PSON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the PSON package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to PSON Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Emin, Emax Yes Real Minimum and maximum body width
Dmin, Dmax Yes Real Minimum and maximum body length (side containing pin 1)
D2min, D2max Optional Real Minimum and maximum thermal pad size on D side.  If there is no thermal pad leave this field blank
E2min, E2max Optional Real Minimum and maximum thermal pad size on E side.  If there is no thermal pad leave this field blank
Bmin, Bmax Yes Real Minimum and maximum lead width
cmin, cmax Optional Real Minimum and maximum lead height
Lmin, Lmax Yes Real Minimum and maximum lead length
L1min, L1max Optional Real Minimum and maximum lead pullback
Amax Yes Real Maximum height
Amin Optional Real Minimum height
A1max Optional Real Maximum standoff height
A1min Yes Real Minimum standoff height
PinCount Yes Integer Total number of pin positions (including absent pins)
Pitch Yes Real Pitch (e)
AbsentPins Optional String Comma separated list showing absent pins.  Example: 1,2,5. If blank all pins present
PinOrder Optional String Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount.  Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
Periphery Optional Real  
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to PSON Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Yes Real Distance between pads. Measured from outside edges
C Optional Real Row spacing. Distance between pad centers
G Yes Real Distance between pads. Measured from inside edges
X Yes Real Pad width
Y Yes Real Pad length
E2t Optional Real Thermal Pad width (X2)
D2t Optional Real Thermal Pad length (Y2)
A Yes Real Assembly width (E side)
B Yes Real Assembly length (D side)
V1 Yes Real Courtyard width (E side)
V2 Yes Real Courtyard length (D side)
R1 Yes Real Silkscreen width (E side)
R2 Yes Real Silkscreen length (D side)
ViaCountE Optional Integer Number of thermal vias in the E direction
ViaCountD Optional Integer Number of thermal vias in the D direction
ViaPitchE Optional Real Thermal Via Pitch in the E direction
ViaPitchD Optional Real Thermal Via Pitch in the D direction
XY_Solder Optional Real Peripheral Pads - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank
X2Y2_Solder Optional Real Thermal Pad - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank
XY_Paste Optional Real Peripheral Pads - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank.
X2Y2_Paste Optional Real Thermal Pad - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank.
X_Paste Optional Real Peripheral Pads - Fill on Top Paste Layer. Value in X direction.
Y_Paste Optional Real Peripheral Pads - Fill on Top Paste Layer. Value in Y direction.
X2_Paste Optional Real Thermal Pad- Fill on Top Paste Layer. Value in X direction.
Y2_Paste Optional Real Thermal Pad- Fill on Top Paste Layer. Value in Y direction.
FillCountE Optional Integer Number of Top Paste fills placed on the thermal pad in the E direction (No Paste Mask fills placed if blank)
FillCountD Optional Integer Number of Top Paste fills placed on the thermal pad in the D direction (No Paste Mask fills placed if blank)
Fill_Gap Optional Real Gap between Top Paste fills placed on the thermal pad (0.2mm if blank)

SODFL

Description: Small Outline Diode, Flat Lead

Included Packages: SODFL

Support for SODFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SODFL package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to SODFL Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Dmin, Dmax Yes Real Minimum and maximum body length
Emin, Emax Yes Real Minimum and maximum lead span
E1min, E1max Yes Real Minimum and maximum body width
Bmin, Bmax Yes Real Minimum and maximum width
Lmin, Lmax Yes Real Minimum and maximum lead length
Amin, Amax Yes Real Minimum height
DensityLevel Yes L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
JHmin Optional Real Minimum value for heel fillet
JSmin Optional Real Minimum value of side fillet
JTmin Optional Real Minimum value for toe fillet
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to SODFL Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Optional Real Distance between pads. Measured from outside edges
C Optional Real Distance between pads. Measured from pad centre
G Optional Real Distance between pads. Measured from inside edges
X Optional Real Pad width
Y Optional Real Pad length
X1 Optional Real Pad width (large pad)
A Optional Real Assembly width
B Optional Real Assembly length
V1 Optional Real Courtyard width
V2 Optional Real Courtyard length
R1 Optional Real Silkscreen width
R2 Optional Real Silkscreen length

SON

Description: Small Outline No-lead

Included Packages: SON, SON Exposed Pad

Support for SON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SON package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to SON Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Emin, Emax Yes Real Minimum and maximum body width
Dmin, Dmax Yes Real Minimum and maximum body length (side containing pin 1)
D2min, D2max Optional Real Minimum and maximum thermal pad size on D side.  If there is no thermal pad leave this field blank
E2min, E2max Optional Real Minimum and maximum thermal pad size on E side.  If there is no thermal pad leave this field blank
Bmin, Bmax Yes Real Minimum and maximum lead width
cmin, cmax Optional Real Minimum and maximum lead height
Lmin, Lmax Yes Real Minimum and maximum lead length
L1min, L1max Optional Real Minimum and maximum lead pullback
Amax Yes Real Maximum height
Amin Optional Real Minimum height
A1max Optional Real Maximum standoff height
A1min Yes Real Minimum standoff height
PinCount Yes Integer Total number of pin positions (including absent pins)
Pitch Yes Real Pitch (e)
AbsentPins Optional String Comma separated list showing absent pins.  Example: 1,2,5. If blank all pins present
PinOrder Optional String Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount.  Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package
DensityLevel Optional L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
JHmin Optional Real Minimum value for heel fillet.
JSmin Optional Real Minimum value for side fillet.
JTmin Optional Real Minimum value for toe fillet.
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to SON Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Yes Real Distance between pads. Measured from outside edges
C Optional Real Row spacing. Distance between pad centers
G Yes Real Distance between pads. Measured from inside edges
X Yes Real Pad width
Y Yes Real Pad length
E2t Optional Real Thermal Pad width (X2)
D2t Optional Real Thermal Pad length (Y2)
A Yes Real Assembly width (E side)
B Yes Real Assembly length (D side)
V1 Yes Real Courtyard width (E side)
V2 Yes Real Courtyard length (D side)
R1 Yes Real Silkscreen width (E side)
R2 Yes Real Silkscreen length (D side)
ViaCountE Optional Integer Number of thermal vias in the E direction
ViaCountD Optional Integer Number of thermal vias in the D direction
ViaPitchE Optional Real Thermal Via Pitch in the E direction
ViaPitchD Optional Real Thermal Via Pitch in the D direction
XY_Solder Optional Real Peripheral Pads - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank
X2Y2_Solder Optional Real Thermal Pad - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank
XY_Paste Optional Real Peripheral Pads - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank.
X2Y2_Paste Optional Real Thermal Pad - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank.
X_Paste Optional Real Peripheral Pads - Fill on Top Paste Layer. Value in X direction.
Y_Paste Optional Real Peripheral Pads - Fill on Top Paste Layer. Value in Y direction.
X2_Paste Optional Real Thermal Pad- Fill on Top Paste Layer. Value in X direction.
Y2_Paste Optional Real Thermal Pad- Fill on Top Paste Layer. Value in Y direction.
FillCountE Optional Integer Number of Top Paste fills placed on the thermal pad in the E direction (No Paste Mask fills placed if blank)
FillCountD Optional Integer Number of Top Paste fills placed on the thermal pad in the D direction (No Paste Mask fills placed if blank)
Fill_Gap Optional Real Gap between Top Paste fills placed on the thermal pad (0.2mm if blank)

SOTFL

Description: Small Outline Transistor, Flat Lead

Included Packages: 3-Leads, 5-Leads, 6-Leads

Support for SOTFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SOTFL package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

Table of data related to SOTFL Package Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
FootprintName Optional String If blank, then auto-generated IPC naming will be used
FootprintDescription Optional String If blank, then description is auto-generated
Dmin, Dmax Yes Real Minimum and maximum body length
Emin, Emax Yes Real Minimum and maximum lead span
E1min, E1max Yes Real Minimum and maximum body width
PinCount Yes 3,5 Total number of pin positions, not including tab
PinOrder Optional String Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount.  Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package
AbsentPins Optional String Comma separated list showing absent pins.  Example: 1,2,5. If blank all pins present
Bmin, Bmax Yes Real Minimum and maximum width of narrow leads
B1min, B1max Optional Real Minimum and maximum width of wide lead (3 pin packages only)
cmin, cmax Optional Real Minimum and maximum lead thickness
L1min, L1max Optional Real Minimum and maximum lead length (from body to end of lead)
LPmin, LPmax Yes Real Minimum and maximum lead length
Pitch Yes Real Pitch (e)
Amin, Amax Yes Real Minimum height
DensityLevel Yes L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C)
JHmin Optional Real Minimum value for heel fillet
JSmin Optional Real Minimum value of side fillet
JTmin Optional Real Minimum value for toe fillet
DrawingNote Optional String If package has other features that will affect the footprint, then enter details.

Table of data related to SOTFL Footprint Specifications.

Name
Value Required
Format
Description (Dimensions in mm)
Z Optional Real Distance between pads. Measured from outside edges
C Optional Real Distance between pads. Measured from pad centre
G Optional Real Distance between pads. Measured from inside edges
X Optional Real Pad width
Y Optional Real Pad length
X1 Optional Real Pad width (large pad)
A Optional Real Assembly width
B Optional Real Assembly length
V1 Optional Real Courtyard width
V2 Optional Real Courtyard length
R1 Optional Real Silkscreen width
R2 Optional Real Silkscreen length

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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