Full Stackup Definition Available for Vias

As manufacturing technology improves and allows higher trace density, it's become increasingly important to allow land sizes to be set independently for each signal layer. It's now possible in Altium Designer Winter 09 to define via stack-ups that have varying sizes of round via shapes and on any of the signal layers specifically for this design scenario.

An updated Via Properties dialog has new controls that allow you to specify via stack-up sizes. For ease of both the initial object specification and future editing, first select the basis of the Diameter mode, similar to the Size and Shape mode on the existing Pad Properties dialog. Simple mode specifies a consistent size throughout all defined layers of the via. Top-Middle-Bottom mode allows you to vary the via's sizes on top, middle, and bottom layers, with all middle layers set to an equivalent size. Full Stack mode allows you to specify any size on any layer.


An example via with a complex stackup