Improved Diagonal Thermal Connections

In previous versions of the software, 45 degree thermal connections between a rectangular SMD pad and a polygon pour, would enter such that the thermal tracks would go to the pad's center, as shown in the image on the left below.

In Altium Designer 14.3 this has been improved, so that the 45 degree connections now enter at the pad's corners, as shown in the image on the right, rather than radiating from the pad center as they did in earlier versions.

Thermal connections now enter rectangular pads at the pad corners rather than radiating from the pad center, as they did in earlier versions of Altium Designer.